Especificações Técnicas

LIQUIDO REMOVEDOR DE COLA DE BGA DESCRIÇÃO: O HS-BGA IC AMOLECE E ELIMINA RESIDOS DE COLA E SELAGEM DE CHIP BGA. TEM BOA PERMEABILIDADE, PODE RAPIDAMENTE AMOLECER E SOLTAR ADESIVO OU RESINA SOLIDIFICADA, TAIS COMO FENÓIS, EPÓXI, DE ACRILATO DE POLIURETANO, ORGANOSILICON. NÃO DANIFICA A PLACA DE CIRCUITO IMPRESSO E COMPONENTES. INTRODUCTION: BGA IC ADHESIVE REMOVING LIQUID SOFTENS AND REMOVES RESINATING AND SEALING GLUE OF CHIP BGA IC OF MOBILE PHONES. THE INGREDIENTS OF IT IS ENVIRONMENTAL PROTECTION AND SAFEST. IT HAS GOOD PERMEABILITY; IT CAN QUICKLY SOFTEN AND LOOSENS SOLIDIFIED RESIN ADHESIVE SUCH AS PHENOLICS, EPOXY, ACRYLATE, POLYURETHANE, ORGANOSILICON. IT DOES NOT TO HARM TO CIRCUIT BOARD AND COMPONENT, EVEN TO MAINTENANCE WORKER. DIRECTION: 1. USE A TWEEZERS TO PICK A PIECE OF COTTON WOOL WITH BIGGER SIZE TO BGA CHIP AND DIP IT INTO THE GLUE REMOVER. 2. PUT THE COTTON WOOL ON THE BGA CHIP AND COVER THROUGH 3. PLACE A PLASTIC BAG OR FILM ON THE TOP AND COVER THE PCB BOARD 4. WAIT FOR 20MINS. 5. REDO STEP 1 TO 4 6. USE A TWEEZERS TO REMOVE SOFTENED SEALING GLUE AROUND THE BGA 7. USE HOT AIR GUN (300DEG. C) TO HEAT UP THE CHIP. THE GLUE AT THE BOTTOM WILL MELT AND SOFTEN BY HEAT 8. USE A TWEEZERS / CUTTER TO REMOVE THE CHIP BGA-IC LIQUIDO REMOVEDOR DE COLA EPOXI DE CHIP TAGS DE BGA-IC: 34-1379, BGA IC, IC BGA, BGA IC ADHESIVE REMOVING LIQUID, REMOVEDOR DE COLA, REMOVEDOR DE BGA, REMOVEDOR DE RESINA, REMOVEDOR DE EPOXI, BGA, HS-BGA, BGA-IC, OEM

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